Memory cells, methods of forming memory cells, and methods of programming memory cells

ABSTRACT

Some embodiments include methods in which a memory cell is formed to have programmable material between first and second access lines, with the programmable material having two compositionally different regions. A concentration of ions and/or ion-vacancies may be altered in at least one of the regions to change a memory state of the memory cell and to simultaneously form a pn diode. Some embodiments include memory cells having programmable material with two compositionally different regions, and having ions and/or ion-vacancies diffusible into at least one of the regions. The memory cell has a memory state in which the first and second regions are of opposite conductivity type relative to one another.

RELATED PATENT DATA

This patent resulted from a divisional of U.S. patent application Ser.No. 13/919,677, which was filed Jun. 17, 2013, and which is herebyincorporated herein by reference; which resulted from a divisional ofU.S. patent application Ser. No. 13/034,031, which was filed Feb. 24,2011, which issued as U.S. Pat. No. 8,488,365, and which is herebyincorporated herein by reference.

TECHNICAL FIELD

Memory cells, methods of forming memory cells, and methods ofprogramming memory cells.

BACKGROUND

Memory is one type of integrated circuitry, and is used in computersystems for storing data. Integrated memory is usually fabricated in oneor more arrays of individual memory cells. The memory cells may bevolatile, semi-volatile, or nonvolatile. Nonvolatile memory cells canstore data for extended periods of time, and in some instances can storedata in the absence of power. Volatile memory dissipates and istherefore refreshed/rewritten to maintain data storage.

The memory cells are configured to retain or store memory in at leasttwo different selectable states. In a binary system, the states areconsidered as either a “0” or a “1”. In other systems, at least someindividual memory cells may be configured to store more than two levelsor states of information.

There is a continuing effort to produce smaller and denser integratedcircuits. The smallest and simplest memory cell will likely be comprisedof two electrically conductive electrodes having a programmable materialreceived between them. Such memory cells may be referred to ascross-point memory cells.

Programmable materials suitable for utilization in cross-point memorywill have two or more selectable and electrically differentiable memorystates. The multiple selectable memory states can enable storing ofinformation by an individual memory cell. The reading of the cellcomprises determination of which of the memory states the programmablematerial is in, and the writing of information to the cell comprisesplacing the programmable material in a predetermined memory state. Someprogrammable materials retain a memory state in the absence of refresh,and thus may be incorporated into nonvolatile memory cells.

Significant interest is presently being directed toward programmablematerials that utilize ions as mobile charge carriers. The programmablematerials may be converted from one memory state to another by movingthe mobile charge carriers therein to alter a distribution of chargedensity within the programmable materials. Memory devices that utilizemigration of mobile charge carriers to transition from one memory stateto another are sometimes referred to as Resistive Random Access Memory(RRAM) cells.

A difficulty in utilizing memory cells that simply consist ofprogrammable material received between a pair of electrodes (i.e.,cross-point memory cells) is that there can be substantial leakage ofcurrent through the devices, and such may adversely lead to errorsduring retrieval of stored data from a memory array. Accordingly, diodesor other select devices are commonly paired with the memory cells toassist in control of current through the memory cells. The selectdevices consume valuable space, and accordingly it would be desirable todevelop memory cells which could perform suitably without adjacentselect devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 are graphical, diagrammatic illustrations of the effect of ionconcentration on the conductivity type of some materials.

FIG. 4 shows diagrammatic views of an example embodiment memory cell ina first memory state (a “RESET” state) and a second memory state (a“SET” state), with such memory states being shown to be interchangeablethrough application of electric field (EF).

FIG. 5 is a graphical illustration of an example curve of current (I)versus voltage (V) characteristics for the memory cell of FIG. 4.

FIG. 6 is a schematic illustration of an example circuit layout that maybe utilized for an array of memory cells having characteristics of theFIG. 4 memory cell.

FIG. 7 shows diagrammatic views of another example embodiment memorycell in a first memory state (a “RESET” state) and a second memory state(a “SET” state), with such memory states being shown to beinterchangeable through application of electric field (EF).

FIG. 8 is a graphical illustration of an example curve of current (I)versus voltage (V) characteristics for the memory cell of FIG. 7.

FIG. 9 shows diagrammatic views of another example embodiment memorycell in a first memory state (a “RESET” state) and a second memory state(a “SET” state), with such memory states being shown to beinterchangeable through application of electric field (EF).

FIG. 10 is a graphical illustration of an example curve of current (I)versus voltage (V) characteristics for the memory cell of FIG. 9.

FIG. 11 shows diagrammatic views of another example embodiment memorycell in a first memory state (a “RESET” state) and a second memory state(a “SET” state), with such memory states being shown to beinterchangeable through application of electric field (EF).

FIG. 12 is a diagrammatic view of another example embodiment memorycell.

FIG. 13 shows diagrammatic views of another example embodiment memorycell in a first memory state (a “RESET” state) and a second memory state(a “SET” state), with such memory states being shown to beinterchangeable through application of electric field (EF).

FIG. 14 shows diagrammatic views of another example embodiment memorycell in a first memory state (a “RESET” state) and a second memory state(a “SET” state), with such memory states being shown to beinterchangeable through application of electric field (EF).

FIGS. 15-19 show diagrammatic cross-sectional views of a portion of asemiconductor construction at various stages of an example embodimentprocess for fabricating a memory array.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In some embodiments, the invention includes memory cells which areprogrammed by altering a concentration of ions within at least oneregion of a programmable material. The memory cells may be furtherconfigured so that a pn diode forms within the programmable materialsimultaneously with a transition of the programmable material into ahigh-conductivity (i.e., low-resistance) memory state. Accordingly, thememory cells may have a pn diode intrinsically formed within aprogrammable material as the programmable material transitions into ahigh-conductivity memory state.

As discussed above in the “Background” section of this disclosure, aproblem associated with prior art cross-point memory architectures canbe that such architectures have select devices external of the memorycells, and paired with each of the memory cells, which increases thespace consumed by such architectures. In contrast, some embodiments ofthe present invention may have a diode intrinsically formed within theprogrammable material, and may utilize such diode in place of theconventional select devices that would otherwise be formed externally ofthe memory cell. Such may enable higher integration density to beachieved than is achieved with prior art memory cells.

Some systems are known in which ions may be utilized to induce aconductivity type (specifically, n-type or p-type). FIG. 1 graphicallyillustrates a system in which a conductivity type is influenced by theconcentration of ions (represented as [I]). Specifically, at some ionconcentrations the system is in a regime 10 having n-typecharacteristics, and at other ion concentrations the system is in aregime 14 having p-type characteristics. An intermediate regime 12 isbetween the regimes 10 and 14, and in such intermediate regime thesystem may have characteristics which are indeterminate relative ton-type and p-type, or may have other electrical characteristics (such aselectrically insulative characteristics), depending on the system.

The system of FIG. 1 is also shown comprising a regime 9 in which theconcentration of ions is less than that suitable to induce n-typecharacteristics, as well as a regime 15 in which the concentration ofions is greater than that which induces p-type characteristics. Eitherof the regimes 9 and 15 may have conventional electrically insulativecharacteristics, or conventional electrically conductivecharacteristics, depending on the system.

FIG. 2 illustrates the same system as FIG. 1, but shown with analternative convention relative to that of FIG. 1. Specifically, FIG. 2shows the conductivity type of the system being influenced by theconcentration of ion vacancies (represented as [V₁]). The concentrationof ion vacancies may be roughly inverse to the concentration of ions.Accordingly, FIG. 2 shows the same regions 9, 10, 12, 14 and 15 as FIG.1, but shows such regions having an inverse relationship relative to therelationship illustrated in FIG. 1. The “vacancies” are typically notempty spaces, but rather are regions where ions could be present, andare not. Such regions may have any of numerous configurations, but arereal physical moieties that can have measurable mobility within asystem.

A distribution of ions within a material may be described as either theconcentration of the ions themselves, or as the concentration ofvacancies of the ions. The vacancies will typically have an oppositecharge to the ions themselves. In some contexts it is conventional torefer to positively-charged species in a system. In such contexts, itwill be the charge which will determine whether a system is described interms of vacancy concentration or ion concentration. For instance, sinceoxygen-containing ions typically have a negative charge, it may bepreferred to describe the charged species of an oxygen-based system asvacancies in some contexts.

Although the concentration of ion vacancies is sometimes considered asthe inverse of the concentrations of ions, there may not be a simplecorrelation between the concentration of ions and the concentration ofion vacancies in some systems. For instance, there may be differencesbetween ion mobility and ion vacancy mobility which leads to fasteraccumulation of either ions or vacancies, and thus leads to imbalancebetween a rate of change in ion concentration relative to a rate ofchange of ion vacancy concentration. Accordingly, many of the systemsdescribed herein may be considered to utilize alteration of either orboth of ion concentration and ion vacancy concentration to achievedesired changes within the systems.

FIG. 3 graphically illustrates an oxygen-based system, or, morespecifically, a system in which conductivity type is influenced by aconcentration of oxygen-containing ions. The concentration of oxygenatoms is approximated in FIG. 3 by the concentration ofoxygen-containing ion vacancies (V_(O)). The system has the same regimes9, 10, 12, 14 and 15 discussed above with reference to FIGS. 1 and 2.The system of FIG. 3 may contain oxygen ions distributed within acomposition that comprises oxygen in combination with one or more ofpraseodymium, barium, calcium, manganese, strontium, titanium, iron,cesium and lead. For instance, the composition may comprise one or moreof PrCaMnO, BaSrTiO, SrTiO, SrCeFeO, and PbO, where such compositionsare shown in terms of the elements contained therein, rather than interms of a specific stoichiometry. In some embodiments, the compositionshown as PrCaMnO may correspond to Pr_((1-x))Ca_(x)MnO₃, where x is anynumber greater than 0 and less than 1.

Oxygen-based systems may be highly sensitive to the concentration ofoxygen-containing ions (and/or to the concentration of vacancies ofoxygen-containing ions). For instance, a change in the concentration ofoxygen ions of about 10 parts per million may shift SrTiO from theregime 10 having n-type characteristics to the regime 14 having p-typecharacteristics.

The oxygen-based systems represented by FIG. 3 may be considered tocorrespond to valence change material systems. Specifically, the systemscomprise materials having one or more elements with multiple stablevalence states (for instance, titanium, iron, manganese, etc.). Valencechange systems are example systems that may be utilized in someembodiments. Valance change systems may comprise mobile ions, and/ormobile ion vacancies, that can be moved within the systems to alter ionand ion vacancy concentrations throughout the systems. Mobile ions andmobile ion vacancies may or may not coexist in a single system,depending on the system. Thus, one or both of the mobile speciescorresponding to mobile ions and mobile ion vacancies may be utilized toalter ion concentration, and/or ion vacancy concentration, within agiven system.

Oxygen-based systems of the type represented in FIG. 3 are examples ofthe types of systems that may be utilized in various embodiments of theinvention. Any suitable systems may be utilized, and other examplesystems are sulfur-based systems, nitrogen-based systems, etc.

The curves of FIGS. 1-3 are qualitative representations of therelationship between ion concentration (and/or ion vacancyconcentration) and conductivity type for various systems. The conceptbeing illustrated is that the conductivity type of some systems may beinfluenced and changed by an ion concentration (and/or an ion vacancyconcentration) within such systems. Actual systems may have a differentrelationship between the ion concentration (and/or the ion vacancyconcentration) and the conductivity type besides the simple linearcurves of FIGS. 1-3. However, as long as an ion concentration (and/orthe ion vacancy concentration) within a system can influence and alterthe conductivity type of the system, such system may be suitable forincorporation into the programmable material of memory cells in variousaspects of the present invention.

FIG. 4 illustrates an example memory cell 20 having a programmablematerial 22 sandwiched between a pair of electrodes 24 and 26. In someembodiment, the memory cell may be considered to be an example of abipolar switching RRAM diode cell.

The electrodes 24 and 26 comprise electrically conductive materials 25and 27, respectively. The materials 25 and 27 may comprise any suitableelectrically conductive compositions or combinations of compositions;and in some embodiments may comprise one or more of various metals,metal-containing compositions, and conductively-doped semiconductormaterials. The materials 25 and 27 may be compositionally the same asone another in some embodiments, and may be compositionally differentfrom one another in other embodiments.

In some embodiments, the electrode 24 may be part of a first linearsegment that extends along a first direction (analogous to a firstlinear segment described below with reference to FIG. 19), and theelectrode 26 may be part of a second linear segment that extends along asecond direction that crosses the first direction (analogous to one ofthe second linear segments described below with reference to FIG. 19).The memory cell 20 is formed at a location where the first and secondlinear segments overlap one another, and comprises the programmablematerial 22 directly between the first and second linear segments.

The programmable material 22 comprises two regions 30 and 32 which arecompositionally different from one another, and which may both havecharacteristics of the various systems described above with reference toFIGS. 1-3. For instance, the regions 30 and 32 may comprise any of thevarious oxygen-based systems described with reference to FIG. 3. Thecompositional difference between regions 30 and 32 may be substantial,such as having a composition of one of the regions comprising one ormore elements which are not common to the composition of the other ofthe regions. Alternatively, the compositional difference between regions30 and 32 may be subtle, such as having the same mixture of elementswithin both regions, and having a stoichiometric difference between theregions. In any event, in some embodiments the difference betweenregions 30 and 32 is more than a transitory difference, and thus morethan a mere difference in the population of ions between the tworegions. The interface between the layers 30 and 32 may be abrupt insome embodiments, diffuse in some embodiments, and/or may comprise agradient in some embodiments. Although regions 30 and 32 are describedas being compositionally different than one another, in otherembodiments the difference between regions 30 and 32 may be solely dueto different concentrations of ions within the regions as induced by aprogramming operation.

Although the shown programmable material 22 has two different regions,in other embodiments a programmable material may have more than twodifferent regions. If the programmable material has more than twodifferent regions, all of the regions may be compositionally differentfrom one another; or two or more of the regions may be compositionallythe same as one another, and spaced from one another by at least oneregion which is compositionally different from them.

The regions 30 and 32 are shown to be directly against one another. Inother embodiments the regions may be spaced from one another byintervening materials or regions. For instance, an embodiment discussedbelow with reference to FIG. 11 comprises an insulating material betweenthe regions 30 and 32.

The regions 30 and 32 may comprise any suitable thicknesses, and may beabout the same thickness as one another (as shown), or may be differentthicknesses relative to one another. In some embodiments, each of theregions 30 and 32 may have a thickness of from about 5 nanometers toabout 100 nanometers.

In the example embodiment FIG. 4, each of the regions 30 and 32comprises a system which can be changed from one conductivity type toanother by altering a concentration of ions (and/or ion vacancies)within the system. Both systems are influenced by the same ions (and/orion vacancies), and thus the relative conductivity types of regions 30and 32 may be tailored by altering the relative concentration of theions (and/or ion vacancies) within the two regions 30 and 32.

The distribution of the ions and ion vacancies across programmablematerial 22 is diagrammatically indicated along the sides of theprogrammable material with arrows 31 and 33. Specifically, arrow 31indicates that a concentration of ions ([I]) increases along onedirection through the programmable material, and arrow 33 indicates thatthere is an increase in vacancies of the ion ([V₁]) in a directionopposite to the direction of the arrow 31.

The embodiment of FIG. 4 shows the region of programmable materialhaving a high concentration of ions (or alternatively, a lowconcentration of ion vacancies) being p-type, and shows the region ofthe programmable material having the low concentration of ions (oralternatively, a high concentration of ion vacancies) being n-type. Suchrelationship of ion concentration (or ion vacancy concentration) toconductivity type is consistent with the oxygen-based systems describedabove with reference to FIG. 3. In other embodiments, other systems maybe utilized, and the relationship of conductivity to ion concentration(or ion vacancy concentration) may be opposite to that shown in FIG. 4(e.g., a high ion concentration, or low ion vacancy concentration, maycorrespond to an n-type region rather than corresponding to the p-typeregion shown in FIG. 4).

FIG. 4 shows memory cell 20 in two different interchangeable memorystates, which are designated as a “RESET” state and a “SET” state. Theregions 30 and 32 are of opposite conductivity type relative to oneanother in both of the “RESET” and “SET” memory states.

The two memory states of FIG. 4 are interchanged with one another bysubjecting memory cell 20 to appropriate electric fields. An electricfield oriented along a first direction (the field designated as EF⁽⁺⁾ inFIG. 4) may shift the ion distribution (and/or the ion vacancydistribution) within the memory cell to cause the memory cell totransition from the “RESET” state to the “SET” state. An electric fieldoriented along a second direction opposite to that of the firstdirection (the field designated as EF⁽⁻⁾ in FIG. 4) may shift the iondistribution (and/or the ion vacancy distribution) within the memorycell to cause the memory cell to transition from the “SET” state to the“RESET” state.

The “RESET” memory state has a pn diode in one orientation, and the“SET” memory state has a pn diode in an opposite orientation relative tothat of the “RESET” state. In some embodiments, the regions 30 and 32may be referred to as first and second regions, and the conductivitytypes of such regions in the “SET” state may be referred to as first andsecond conductivity types, respectively; with the first and secondconductivity types being opposite to another. In such embodiments, theconductivity type of the first region 30 is transitioned from the firstconductivity type (shown as n-type), to the second conductivity type(shown as p-type) in changing the memory cell from the “SET” state tothe “RESET” state; and the conductivity type of the second region 32 istransitioned from the second conductivity type to the first conductivitytype in changing the memory cell from the “SET” state to the “RESET”state. It is noted that the pn diodes of the “SET” and “RESET” memorystates are formed within the programmable material 22 simultaneouslywith the programming of the memory cell into such memory states.

The embodiment of FIG. 4 has conductivity types of the first and secondregions 30 and 32 of the “SET” state induced by changes inconcentrations of ions (and/or by changes in concentrations of ionvacancies) within each of such regions. In other embodiments (forinstance, embodiments discussed below with reference to FIGS. 13 and14), one of the regions of the programmable material may have a staticconductivity type (i.e., a conductivity type which is not changed intransitioning between the “RESET” and “SET” memory states). Accordingly,if the programmable material has two regions, it may be only one of suchregions that has a conductivity type induced by a change in aconcentration of ions (and/or by a change in a concentration of ionvacancies).

In some embodiments, the reading of the memory cell 20 of FIG. 4comprises determination of the amount of current passed through thememory cell when an electric field is provided across the programmablematerial. It is noted that the conditions utilized to transition thememory cell from one memory state to another will use some suitablecombination of a sufficient magnitude of electric field, coupled with asufficient duration of time to enable redistribution of ions (and/or ionvacancies) within the programmable material. The conditions utilizedduring the reading operation may be chosen to have one or both of themagnitude of electric field and the duration of time that the field isapplied to be too low to transition the memory cell from one memorystate to another.

The electric field utilized to read the memory cell may be applied alonga direction which forward biases the pn diode of the “SET” memory state,and reverse biases the pn diode of the “RESET” memory state.Accordingly, memory cells in the “SET” memory state will pass greatercurrent then memory cells in the “RESET” memory state, and thus may bedistinguished from the memory cells in the “RESET” memory state.

In the embodiment of FIG. 4, the ions (and/or ion vacancies) utilizedfor transitioning the memory cell from one state to another may becontained entirely within the programmable material, and diffused fromone region to another during the programming of the memory cell. In suchembodiments, barriers may be provided entirely around the programmablematerial 22 to trap the ions (and/or the ion vacancies) within theprogrammable material. In some embodiments, the electrodes 24 and 26 maycomprise material which blocks diffusion of ions (and/or ion vacancies)therethrough (i.e., which is impermeable to the ions or ion vacancies),and may be directly against the programmable material. In someembodiments, one or more layers of barrier material (not shown) may beprovided between the electrodes and the programmable material, and/oralong the sides of the programmable material. Example barrier materialswhich may be used to block diffusion of oxygen-containing ions aredescribed in U.S. Patent Publication No. 2010/0237442, as well as inU.S. Pat. Nos. 6,524,867, 7,727,908, 7,273,791, 7,393,785, 7,544,987 and7,560,815. Example electrically conductive materials which may blockdiffusion of oxygen-containing ions, and which may be utilized inelectrodes in some embodiments can include, for example, Al, Ir, Ru,RuTiN, RuTiO, RuO—Ta, CeO—Ta, TaN, etc., where such materials are shownin terms of the elements contained therein, rather than in terms of aspecific stoichiometry.

If one or both of the electrodes 24 and 26 is spaced from theprogrammable material 22 by a barrier material (for instance, an oxygenion-barrier material and/or an oxygen-ion-vacancy barrier material), thebarrier material may be electrically insulative or electricallyconductive. If the barrier material is electrically insulative, it maybe formed to be thin enough that current can still pass through thebarrier material during reading and programming of the memory cell. Ifthe barrier material is electrically conductive, it may be considered tobe comprised by the electrode that is directly adjacent to the barriermaterial.

FIG. 5 shows a “current vs. voltage” curve illustrating performancecharacteristics of the memory cell 20 of FIG. 4. The curve has fourimportant events which are specifically labeled along such curve.

The event (1) corresponds to an increase in voltage while the memorycell remains in the “RESET” memory state.

The next event (2) corresponds to a transition that occurs when thevoltage reaches a level Vset, whereupon the pn diode of the “RESET”memory state is reversed to transition the memory cell into the “SET”memory state. It is noted that the current flow through the “SET” memorystate is cut-off (i.e., truncated) at a level 35. Such truncationrepresents a current cut-off provided for current compliance to protectsemiconductor devices. In theory, such cut-off would not exist for anidealized memory device utilized in the absence of other circuitry, butin practice it is generally utilized.

The next event (3) corresponds to a decrease in voltage while the memorydevice remains in the “SET” memory state. There is a voltage levelindicated as Vt1, which is below the level Vset, but at whichsubstantial current flows through the memory cell in the “SET” memorystate. Such level may correspond to a suitable voltage level for readingthe memory device without inadvertently tripping the device into the“SET” or “RESET” memory state.

The next event (4) corresponds to a transition that occurs when thevoltage reaches a level Vreset, whereupon the pn diode of the “SET”memory state is reversed to transition the memory cell into the “RESET”memory state. The current flow through the “RESET” memory state may becut-off at a level 37 for the current compliance reasons discussed aboverelative to the cut-off level 35.

The “RESET” memory state of the memory cell 20 of FIG. 4 may be exactlythe opposite of the “SET” memory state of such memory cell. Accordingly,reading of the memory cell may comprise utilization of electric fieldoriented such that the pn diode of the “RESET” is forward biased, whilethe pn diode of the “SET” state is reverse biased. Such read operationis diagrammatically illustrated in FIG. 5 by indicating a voltage levelVt2 which could be utilized analogously to the above-discussed voltagelevel Vt1, but which would forward bias the pn diode of the “RESET”memory state.

It can be advantageous that the memory cell 20 of FIG. 4 has the twodifferent and opposite read operations which may be accomplished byeither forward biasing the pn diode of the “SET” memory state or the pndiode of the “RESET” memory state. For instance, such can provideadditional flexibility for design of read operations to be utilized forascertaining the memory states of the various memory cells in a memorycell array. However, in some embodiments it is also acceptable to useonly one read operation to distinguish the two states.

The memory cell 20 of FIG. 4 has an intrinsic pn diode within theprogrammable material after the programmable material is transitionedinto a memory state. Such intrinsic diode may eliminate the need for theextrinsic diodes (or other select devices) paired with the cross-pointmemory cells. FIG. 6 shows a schematic diagram of a portion of a memoryarray 38. Such memory array comprises a plurality of cross-point memorycells 20 a-20 i. The memory array also comprises a series of firstaccess lines 40-42 extending along a first direction, and a series ofsecond access lines 43-45 extending along a second direction, andintersecting with the first access lines. The memory cells 20 a-20 i areprovided at locations where the first access lines intersect the secondaccess lines, and thus each memory cell may be uniquely addressedthrough the combination of a first access line and a second access line.

FIG. 6 shows that voltages of ½ unit, 0 unit and ½ unit, respectivelyare along the access lines 40, 41 and 42; and that voltages of ½ unit, 1unit and ½ unit, respectively are along access lines 43, 44 and 45. Inthe shown configuration, the memory cell 20 e will experience anelectric field of 1 unit, which will be significantly larger than theelectric field experienced by any of the other memory cells. Forinstance, memory cells 20 a, 20 c, 20 g and 20 i may experience electricfields of about 0 units, while the memory cells 20 b, 20 d, 20 f and 20h may experience electric fields of about ½ unit. Thus, the memory cell20 e may be uniquely addressed for programming, and similarly may beuniquely addressed for reading. Each of the other of memory cells may beanalogously uniquely addressed for programming and reading. Theprogramming voltage utilized for programming the memory cells of FIG. 6may be, for example, from about 1 volt about 4 volts.

FIG. 7 shows an example embodiment memory cell 50, which is differentthan the example embodiment memory cell 20 of FIG. 4. In referring toFIG. 7, similar numbering will be used as is used above in describingthe memory cell of FIG. 4, where appropriate.

The memory cell 50 has a programmable material 52 sandwiched between thepair of electrodes 24 and 26. The programmable material comprises tworegions 60 and 62 which are compositionally different from one another.One or both of the regions may comprise a system which changesconductivity type depending upon the concentration of ions (and/ordepending on the concentration of ion vacancies) within such system. Forinstance, one or both of the regions may comprise a system of any of thetypes described above with reference to FIGS. 1-3.

The memory cell 50 is shown to have interchangeable “RESET” and “SET”memory states; with such states being interchanged using the electricfields EF⁽⁺⁾ and EF⁽⁻⁾.

The “SET” memory state is similar to the “SET” memory state of the FIG.4 memory cell, and accordingly comprises a pn diode within theprogrammable material 52. Further, the “SET” state of memory cell 50 isshown to have ions (or vacancies) diffused within both of the regions 60and 62. The arrows 31 and 33 are provided along the memory cell in the“SET” memory state to illustrate that an ion concentration increasesalong a direction from region 60 to 62, and that an ion vacancyconcentration increases along a direction from region 62 to 60. Theshown embodiment has a p-type region at high levels of the ionconcentration (or alternatively considered, at low levels of the ionvacancy concentration); and has an n-type region at low levels of theion concentration (or alternatively considered, at high levels of theion vacancy concentration). In other embodiments, the relativedependence on the ion concentration (or ion vacancy concentration) ofthe p-type and n-type regions may be reversed—i.e., the n-type regionmay occur at high concentrations of the ions (or low concentrations ofion vacancies), and the p-type region may occur at low concentrations ofthe ions (or high concentrations of ion vacancies).

The regions 60 and 62 in the “RESET” memory state of the memory cell arenot labeled relative to n-type and p-type. In some embodiments, one orboth of the regions 60 and 62 may have electrically insulativeproperties in the “RESET” memory state. For instance, one or both of theregions 60 and 62 may have ions (or vacancies) diffused therein to aconcentration corresponding to the regime 12 of FIGS. 1-3. Such regimeis neither n-type nor p-type, and in some embodiments may havecharacteristics of electrically insulative material. Alternatively, theelectrically insulative regime may occur in one or both of the regimes 9and 15 of FIGS. 1-3 when the ion concentration (or ion vacancyconcentration) is outside of appropriate concentrations for the n-typeand p-type regimes 10 and 14.

Although neither of the regions 60 and 62 of the “RESET” state isspecifically labeled as n-type or p-type, in some embodiments one of theregions may be n-type or p-type, while the other is electricallyinsulative. For instance, region 60 may be n-type or p-type, whileregion 62 is electrically insulative; or vice versa.

In an example embodiment in which region 60 is p-type and region 62 iselectrically insulative, the transition to the “SET” memory statecomprises changing conductivity of both regions. Specifically, region 62is changed from electrically insulative to p-type, and region 60 ischanged from p-type to n-type.

In an example embodiment in which region 60 is n-type and region 62 iselectrically insulative, the transition to the “SET” memory statecomprises changing conductivity of only region 62. Specifically, region62 is changed from electrically insulative to p-type, while region 60remains n-type.

Even though region 60 may remain n-type in both the “RESET” and “SET”memory states of the memory cell, the concentration of ion vacancieswithin region 60 may increase (and/or the concentration of ions maydecrease) in going from the “RESET” memory state to the “SET” memorystate. For instance, regions 60 and 62 may comprise different systems,with the system of region 62 needing a higher concentration of ionvacancies (and/or a lower concentration of ions) to transition into ap-type regime than does the region 60. Thus, in the “RESET” memory statethe region 60 may be n-type even though it has a significant ionconcentration (and/or has a low concentration of ion vacancies).Subsequently, the transition into the “SET” state may comprise diffusionof ions from region 60 into region 62 (and/or diffusion of ion vacanciesfrom region 62 to region 60), and there may be enough ions (and/or ionvacancies) migrating between regions 60 and 62 to convert the system ofregion 62 into the p-type regime. As another example, regions 62 and 60may comprise similar systems, but region 62 may be much thinner thanregion 60. Thus, even though the concentration of ions and/or vacancieswithin the region 60 is insufficient to achieved the necessaryconcentration to convert the thick region 60 into the p-type regime inthe “RESET” memory state, there are enough ions and/or ion vacanciesmigrating between the thick region 60 and the thin region 62 during thetransition to the “SET” memory state to convert region 62 into thep-type regime. Alternatively, region 60 may be an n-type semiconductormaterial that is not affected by the ion concentration (or ion vacancyconcentration), analogously to constructions discussed below withreference to FIG. 13.

FIG. 8 shows a “current vs. voltage” curve illustrating performancecharacteristics of the memory cell 50 of FIG. 7. The curve has fourimportant events which are specifically labeled along such curve, withsuch events being analogous to the events described above with referenceto the “current vs. voltage” curve of FIG. 5.

The event (1) corresponds to an increase in voltage while the memorycell remains in the “RESET” memory state. In the shown embodiment, theprogrammable material 52 (FIG. 7) has at least one electricallyinsulative region (i.e., at least one of the regions 60 and 62 of FIG. 7is electrically insulative in the “RESET” state), and thus no currentflows through the memory cell while the cell is in the “RESET” state.

The next event (2) corresponds to a transition that occurs when thevoltage reaches a level Vset, whereupon the pn diode of the “SET” memorystate is formed. The current flow through the “SET” memory state has thecut-off at level 35 discussed above with reference to FIG. 5.

The next event (3) corresponds to a decrease in voltage while the memorydevice remains in the “SET” memory state. There is a voltage levelindicated as Vt1 analogous to the level Vt1 discussed above withreference to FIG. 5. Such level may correspond to a suitable voltagelevel for reading the memory device.

The next event (4) corresponds to a transition that occurs when thevoltage reaches a level Vreset, whereupon the at least one insulativeregion is reformed, and current ceases to flow through the memorydevice.

FIG. 9 shows another example embodiment memory cell 70. The memory cell70 is equivalent to the memory cell 50 of FIG. 7, but inverted relativeto the memory cell of FIG. 7.

The memory cell 70 has the programmable material 52 sandwiched betweenthe pair of electrodes 24 and 26. The programmable material comprisesthe two regions 60 and 62 described above.

The memory cell 70 has the interchangeable “RESET” and “SET” memorystates described above with reference to FIG. 7. However, the pn diodewithin the “SET” memory state of FIG. 9 is inverted relative to that ofFIG. 7. Arrows 31 and 33 are provided in FIG. 9 along the memory cell inthe “SET” memory state to illustrate that an ion concentration increasesalong a direction from region 62 to 60, and that an ion vacancyconcentration increases along a direction from region 60 to 62.

Like the embodiment of FIG. 7, neither of the regions 60 and 62 of the“RESET” state of FIG. 9 is specifically labeled as n-type or p-type. Insome embodiments both of the regions 60 and 62 may be electricallyinsulative in the “RESET” state of FIG. 9; and in other embodiments oneof the regions may be n-type or p-type, while the other is electricallyinsulative. For instance, region 60 may be n-type or p-type, whileregion 62 is electrically insulative.

In an example embodiment in which region 60 is n-type and region 62 iselectrically insulative, the transition to the “SET” memory statecomprises changing conductivity of both regions. Specifically, region 62is changed from electrically insulative to n-type, and region 60 ischanged from n-type to p-type. Such may comprise diffusing ions (orvacancies) from the insulative region 62 of the “RESET” memory stateinto the region 60 to transition to the “SET” memory state.

In an example embodiment in which region 60 is p-type and region 62 iselectrically insulative, the transition to the “SET” memory statecomprises changing conductivity of only the region 62. Specifically,region 62 is changed from electrically insulative to n-type, whileregion 60 remains p-type. Such may comprise diffusing ions (orvacancies) between the regions 60 and 62. The shown configuration is anexample configuration in which regions with a relatively high ionconcentration (and a relatively low ion vacancy concentration) arep-type, and regions with a relatively low ion concentration are n-type(and a relatively high ion vacancy concentration).

FIG. 10 shows a “current vs. voltage” curve illustrating performancecharacteristics of the memory cell 70 of FIG. 9. The curve has fourimportant events which are specifically labeled along such curve, withsuch events being analogous to those described above with reference toFIG. 8, but of opposite orientation relative to those of FIG. 8.

The event (1) of FIG. 10 corresponds to a decrease in voltage while thememory cell remains in the “RESET” memory state.

The next event (2) corresponds to a transition that occurs when thevoltage reaches a level Vset, whereupon the pn diode of the “SET” memorystate is formed.

The next event (3) corresponds to an increase in voltage while thememory device remains in the “SET” memory state. There is a voltagelevel indicated as Vt1 analogous to the level Vt1 discussed above withreference to FIG. 8, which may correspond to a suitable voltage levelfor reading the memory device.

The next event (4) corresponds to a transition that occurs when thevoltage reaches a level Vreset, whereupon the at least one insulativeregion is reformed, and current ceases to flow through the memorydevice.

FIG. 11 shows another example embodiment memory cell 80 withinterchangeable “RESET” and “SET” memory states. In referring to FIG.11, similar numbering will be used as is used above in describing thememory cell of FIG. 4, where appropriate.

The memory cell 80 has a programmable material 82 between the pair ofelectrodes 24 and 26. The programmable material 82 comprises the tworegions 30 and 32 described above with reference to the memory cell 20of FIG. 4. However, the memory cell 80 differs from the memory cell 20of FIG. 4 in that the memory cell 80 comprises an ion (and/or ionvacancy) reservoir 84 between the regions 30 and 32. The reservoir 84may comprise electrically conductive material in some embodiments, andmay comprise electrically insulative material in some embodiments.

In some embodiments, the ions may be oxygen-containing species, andaccordingly the reservoir may be a material which contains an excess ofoxygen-containing species in at least one of the memory states. Forinstance, the reservoir may be an insulative material comprisingoxygen-enriched oxide (such as silicon oxide, aluminum oxide, etc.) inat least one of the memory states. The reservoir may be permeable to theions (and/or to the ion vacancies) in some embodiments.

The ion (and/or ion vacancy) reservoir may be kept very thin so that itdoes not substantially interfere with current flow through theprogrammable material in the “SET” memory state, and in exampleembodiments may have a thickness of less than or equal to about 50angstroms, less than or equal to about 20 angstroms, or any othersuitable thickness.

The reservoir may act as a source of ions (and/or ion vacancies) foraltering one or both of ion density and ion vacancy density in one ofthe regions of the programmable material during a transition from the“RESET” memory state to the “SET” memory state, or vice versa; and/ormay act as a sink for excess ions, or ion vacancies, duringtransitioning from one memory state to the other. In some embodiments,the reservoir may facilitate movement of ions (and/or ion vacancies),which may facilitate rapid switching from one memory state to another,and may thus improve one or both of reading speed and writing speed.

The reservoir 84 may be placed in any suitable location within theprogrammable material, and in some embodiments there may be more thanone reservoir of ions (and/or ion vacancies) provided within theprogrammable material. In the shown embodiment, the reservoir 84 isbetween the regions 30 and 32, and directly against both of suchregions. In other embodiments, the reservoir may be placed in otherlocations.

FIG. 12 illustrates example embodiment memory cell 80 a analogous to thememory cell 80 of FIG. 11, but comprising the reservoir 84 along a topof the programmable material, rather than in a middle of theprogrammable material; and specifically directly between the region 32and the top electrode 26. As noted above, in some embodiments thereservoir 84 may correspond to an electrically conductive material.Accordingly, in some embodiments the memory cell of FIG. 12 may beconsidered to comprise an electrically conductive material 84 directlybetween the top electrode 26 and the top region 32 of the programmablematerial.

FIG. 13 shows another example embodiment memory cell 90 withinterchangeable “RESET” and “SET” memory states. In referring to FIG.13, similar numbering will be used as is used above in describing thememory cell of FIG. 4, where appropriate.

The memory cell 90 has a programmable material 92 between the pair ofelectrodes 24 and 26. The programmable material comprises two regions 94and 96 which are compositionally different from one another. The region94 comprises p-type doped semiconductor material (for instance, p-typedoped silicon) while the region 96 comprises a system which changesconductivity type depending upon the concentration of ions, orion-vacancies, within such system. For instance, the region 96 maycomprise a system of any of the types described above with reference toFIGS. 1-3. The conductivity of the doped semiconductor material ofregion 94 does not change in transitioning between the “RESET” memorystate and the “SET” memory state, and in the shown embodiment remainsp-type in both memory states.

The region 96 is shown to have n-type conductivity in the “SET” memorystate, so that regions 94 and 96 together form a pn diode in the “SET”memory state.

The region 96 may have electrically insulative properties in the “RESET”state, and an electric field which forward biases the pn diode of the“SET” may be utilized to distinguish the “RESET” memory state from the“SET” memory state.

In the shown embodiment, ions (or vacancies) within programmablematerial 92 are only within the region 96 in both the “RESET” and “SET”memory states (as indicted by the concentration of ions ([I]) beingshown only within the region 96 in FIG. 13). Accordingly, region 94 ofthe programmable material does not act as a reservoir of ions orvacancies during the transition between the “RESET” and “SET” memorystates. Rather, electrode 26 may be configured to be permeable to theions (and/or vacancies), so that ions (and/or vacancies) may passthrough such electrode during transitioning between the “RESET” memorystate and the “SET” memory state. Any suitable electrically conductivematerial permeable to the ions and/or vacancies may be utilized for theelectrode 26. Example materials which are permeable to oxygen-containingions may include Pt and/or materials described in U.S. Pat. No.7,273,791.

The region 96 has a first concentration of ions and/or vacancies, shownas I₁, in the “RESET” memory state; and a second concentration of ionsand/or vacancies, shown as [I]₂, in the “SET” memory state. The secondconcentration of ions and/or vacancies is different than the firstconcentration, and such difference leads to the change in conductivityof the region 96 in transitioning from the “RESET” memory state to the“SET” memory state. In some embodiments the concentration [I]₁ may beabout 0 ions per unit volume, and in other embodiments it may be largerthan 0 ions per unit volume.

Although the upper region 96 is shown to be the region which is alteredin response to concentration of ions and vacancies in the embodiment ofFIG. 13, in other embodiments it may be the lower region 94 which isaltered while the upper region 96 is the conductively-dopedsemiconductor material. Also, although the p-type doped region of thememory cell is shown to be the region corresponding to dopedsemiconductor material, in other embodiments it may be the n-type regionwhich corresponds to doped semiconductor material. For instance, anembodiment analogous to that of FIG. 13 has region 96 corresponding ton-type doped semiconductor material, and region 94 corresponding to asystem which is in an insulative regime in the “RESET” memory state, andthen transitions to the p-type regime in the “SET” memory state due tomigration of ions (and/or vacancies) from or to such system.

FIG. 14 shows another example embodiment memory cell 100 withinterchangeable “RESET” and “SET” memory states. In referring to FIG.14, similar numbering will be used as is used above in describing thememory cell of FIG. 4, where appropriate.

The memory cell 100 has a programmable material 102 between the pair ofelectrodes 24 and 26. The programmable material comprises two regions104 and 108 which are compositionally different from one another. Theregion 104 comprises p-type doped semiconductor material (for instance,p-type doped silicon) while the region 108 comprises a system whichchanges conductivity type depending upon the concentration of ionsand/or vacancies within such system. For instance, the region 108 maycomprise a system of any of the types described above with reference toFIGS. 1-3. The conductivity of the doped semiconductor material ofregion 104 does not change in transitioning between the “RESET” memorystate and the “SET” memory state, and in the shown embodiment remainsp-type in both memory states.

The memory cell 100 may be fabricated with any suitable methodology. Forinstance, the construction may be fabricated by providing the material108 over region 104. The region 106 may be formed during switching fromthe “RESET” to “SET” state—as a push (or growth) of a conductivefilament through the material 108, and may be removed during switchingfrom the “SET” to “RESET” state by dissolving the conductive filament.

The region 108 has a first concentration of ions and/or ion-vacancies(shown as MO in the “RESET” memory state, and the region 106 has asecond concentration of ions and/or ion-vacancies (shown as [I]₂) in the“SET” memory state. The second concentration is different than the firstconcentration, and such difference leads to formation of the filamentousregion 106 in transitioning from the “RESET” memory state to the “SET”memory state. In some embodiments, the concentration [I]₁ may be about 0ions per unit volume, and in other embodiments it may be larger than 0ions per unit volume.

The memory cell 100 may be operated identically to the memory cell 90discussed above with reference to FIG. 13. Notably, the filamentousregion 106 directly contacts both the p-type region 104 and the upperelectrode 26 in the shown embodiment.

The memory cell 100 is an example memory cell having a firstconductivity type filament extending between an electrode and a secondconductivity type region, and other similar memory cells may be formedin other embodiments. For instance, in some embodiments, the region 104may be n-type doped semiconductor material, and thus may be staticallyn-type in transitioning between the “RESET” memory state and the “SET”memory state. In such embodiments, the filamentous region 106 may bep-type.

Any suitable process may be utilized to form the various memory cellsdiscussed above with reference to FIGS. 1-14. An example process forforming an array of memory cells is described with reference to FIGS.15-19.

Referring to FIG. 15, a construction 200 is shown to comprise a base212, an electrically insulative material 214 over the base, and a line215 of the electrically conductive electrode material 25 over suchelectrically insulative material.

The base 212 may comprise, consist essentially of, or consist ofmonocrystalline silicon, and may be referred to as a semiconductorsubstrate, or as a portion of a semiconductor substrate. The terms“semiconductive substrate,” “semiconductor construction” and“semiconductor substrate” mean any construction comprisingsemiconductive material, including, but not limited to, bulksemiconductive materials such as a semiconductive wafer (either alone orin assemblies comprising other materials), and semiconductive materiallayers (either alone or in assemblies comprising other materials). Theterm “substrate” refers to any supporting structure, including, but notlimited to, the semiconductive substrates described above. Although base212 is shown to be homogenous, the base may comprise numerous materialsin some embodiments. For instance, base 212 may correspond to asemiconductor substrate containing one or more materials associated withintegrated circuit fabrication. In such embodiments, such materials maycorrespond to one or more of refractory metal materials, barriermaterials, diffusion materials, insulator materials, etc.

The electrically insulative material 214 is shown to be spaced from thebase 212 by other levels of integrated circuitry. Such levels mayinclude logic, wiring, memory, etc. Alternatively, the electricallyinsulative material 214 may be directly against an upper surface ofsemiconductor material (for instance, monocrystalline silicon) of base212 in some embodiments.

The electrically insulative material 214 may comprise any suitablecomposition or combination of compositions, and may, for example,comprise one or more of silicon dioxide, silicon nitride, doped silicateglass (e.g., borophosphosilicate glass, phosphosilicate glass,fluorosilicate glass), etc.

The line 215 of the electrode material 25 is shown extending along adirection within the plane of the cross-section of FIG. 15.

Referring to FIG. 16, regions 320 and 322 of the programmable material300 are formed over electrode material 25. In some embodiments, abarrier material of the type described above with reference to FIG. 4(not shown) may be formed over the electrode 25 prior to formation ofprogrammable material 300. The regions 320 and 322 may comprise anysuitable materials, including, for example, any of the materials of theregions 30 and 32 of FIG. 4, the regions 60 and 62 of FIG. 7, theregions 94 and 96 of FIG. 13, etc. In some embodiments, the regions 320and 322 may comprise one or more of the oxygen-containing materials ofthe systems described above with reference to FIG. 3. The regions 320and 322 may be referred to as a first region and a second regionrespectively, with the second region being formed over the first region.In some embodiments the first region may ultimately correspond to ann-type doped region of a pn diode formed in the “SET” memory state of amemory cell (such as the memory cell 20 of FIG. 4), and in otherembodiments the first region may ultimately correspond to the p-typedoped region of such diode. In some embodiments, reservoir materialanalogous to the material 84 of FIGS. 11 and 12 may be incorporated intothe programmable material 300.

Referring to FIG. 17, the programmable material 300 is patterned into aplurality of spaced-apart memory cell features 216-218. Such patterningmay comprise formation of a photolithographically-patterned mask (notshown), or any other suitable mask (for instance, a mask formed withpitch-multiplication methodologies), over programmable material 300,followed by a transfer of a pattern from the mask into material 300 withone or more suitable etches, and subsequent removal of the mask to leavethe construction shown in FIG. 17.

Referring to FIG. 18, electrically insulative material 220 is formedwithin the spaces between features 216-218. The electrically insulativematerial 220 may comprise any suitable composition or combination ofcompositions, such as, for example, one or more of silicon dioxide,silicon nitride, doped silicate glass, etc.

The electrically insulative material 220 may be formed in the shownconfiguration by initially forming the electrically insulative materialover and between features 216-218, and then removing the electricallyinsulative from over the features with a suitable planarizationmethodology (for instance, chemical-mechanical polishing).

Referring to FIG. 19, electrode material 27 is formed over the features216-218 of programmable material 300, and patterned to form a pluralityof lines 231-233. The lines 231-233 extend along a direction orthogonalto the cross-section of FIG. 19, and specifically extend in and out ofthe page relative to the view of FIG. 19. Accordingly, the lines 231-233of top electrode material 27 extend substantially orthogonally relativeto the line 215 of the bottom electrode material 25.

The top electrode material 27 may be patterned into the lines 231-233with any suitable processing, including, for example, utilization of amask (not shown), one or more suitable etches to transfer a pattern fromthe mask into material 27, and subsequent removal of the mask to leavethe construction shown in FIG. 19. In subsequent processing,electrically insulative material (not shown) may be formed over andbetween the lines 231-233.

In the shown embodiment of FIG. 19, the top electrode material 27 isformed directly against programmable material 300. In other embodiments,one or more barrier materials (not shown) of the type described abovewith reference to FIG. 4 may be formed between the top electrodematerial and the programmable material.

The construction of FIG. 19 may correspond to a portion of a memoryarray. Specifically, the line 215 may be representative of a firstseries of access lines that extend along a first direction, and thelines 231-233 may be representative of a second series of access linesthat extend along a second direction, and which overlap the first seriesof access lines. Cross-point memory cells 250 a-c (analogous to thecells discussed above with reference to FIG. 6) are formed at locationswhere the second series of access lines overlap the first series ofaccess lines. Such cross-point memory cells having programmable material300 directly between the access lines of the first series and the accesslines of the second series.

The cross-point memory cells may have intrinsic pn diodes in a “SET”memory state, and may correspond to any of the memory cells describedabove with reference to FIGS. 4, 7, 9, and 11-14. The pn diode may beoriented with the p-type region as the upper region, or with the n-typeregion as the upper region. Thus, in some embodiments, the lower region320 may be n-type in the “SET” memory state, and in other embodimentsthe upper region 322 may be n-type in the “SET” memory state.

The memory cells discussed above may be incorporated into memory arraysof electronic devices, and such devices may be incorporated intoelectronic systems. The electronic systems may be used in, for example,memory modules, device drivers, power modules, communication modems,processor modules, and application-specific modules, and may includemultilayer, multichip modules. The electronic systems may be any of abroad range of systems, such as, for example, clocks, televisions, cellphones, personal computers, automobiles, industrial control systems,aircraft, etc.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. The descriptionprovided herein, and the claims that follow, pertain to any structuresthat have the described relationships between various features,regardless of whether the structures are in the particular orientationof the drawings, or are rotated relative to such orientation.

The cross-sectional views of the accompanying illustrations only showfeatures within the planes of the cross-sections, and do not showmaterials behind the planes of the cross-sections in order to simplifythe drawings.

When a structure is referred to above as being “on” or “against” anotherstructure, it can be directly on the other structure or interveningstructures may also be present. In contrast, when a structure isreferred to as being “directly on” or “directly against” anotherstructure, there are no intervening structures present. When a structureis referred to as being “connected” or “coupled” to another structure,it can be directly connected or coupled to the other structure, orintervening structures may be present. In contrast, when a structure isreferred to as being “directly connected” or “directly coupled” toanother structure, there are no intervening structures present.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

We claim:
 1. A method of forming and programming a memory cell,comprising: forming a programmable material to be between first andsecond access lines, the programmable material having twocompositionally different regions; and altering a concentration of ionsand/or ion vacancies in at least one of the regions of the programmablememory material to change a memory state of the memory cell and tosimultaneously form a pn diode within the programmable material.
 2. Themethod of claim 1 wherein: said at least one of the first and secondregions comprises a composition containing oxygen in combination withone or more of praseodymium, barium, calcium, manganese, strontium,titanium, iron, cesium and lead; and the ions are oxygen-containing ionsand/or the vacancies are vacancies of oxygen-containing ions.
 3. Themethod of claim 1 wherein the memory cell has two memory states, withone of the memory states having the pn diode within the memory cell in afirst orientation within the first and second regions, and with theother of the memory states having a pn diode within the first and secondregions in an opposite orientation to the first orientation.
 4. Themethod of claim 1 wherein the memory cell has two memory states, withone of the memory states having the pn diode within the memory cell, andwith the other of the memory states having one of the regions as anelectrically insulative material.
 5. The method of claim 1 wherein theconcentration of ions and/or of the ion vacancies is altered in one ofthe regions, and wherein the other of the regions is aconductively-doped semiconductor material.
 6. The method of claim 1wherein at least one of the access lines is permeable to the ions and/orto the ion vacancies.
 7. The method of claim 1 wherein neither of theaccess lines is permeable to the ions and/or to the ion vacancies. 8.The method of claim 1 wherein the altering alters a concentration ofoxygen-containing ions.
 9. The method of claim 1 wherein the alteringalters an amount of vacancies of oxygen-containing ions.